Meizu CEO Jack Wong is all ready to announce the new flagship device, called Meizu 16 Plus, on August 26. However, before the launch, leaks reveal the front panel of the Plus-sized variant of the device. The new phone will have practically no bezels on the side and extremely thin top and bottom ones.
Meizu 16 Plus will have extremely thin top
The glass panel of the Meizu 16 Plus came from a component factory in China. The Meizu 16 Plus will have 6.5” screen, and according to the leakster, it will be an OLED panel. There is only one hole on the top bezel for the selfie camera. Moreover, a photo of the opposite side of the phone reveals there is also a proximity sensor and LED notification light. There will also be a Snapdragon 845 chipset and a vapor chamber for cooling.
The Meizu 16 series is expected to have at least one version with an under-display fingerprint scanner. Rumors also claim that the phone will have a price tag of $600.