TSMC aims to use A16 technology to mass produce its upcoming chips. The A16 technology integrates innovative nanosheet transistors along with a novel backside power rail solution. This development is anticipated to provide an 8-10% increase in speed and a 15-20% reduction in power consumption at the same speeds compared to TSMC’s N2P process. In addition, it will provide up to a 1.10x chip density improvement.
TSMC will also roll out its System-on-Wafer (SoW) technology quite soon. It will integrate multiple dies on a single wafer to foster computing power while taking less space. It will be a transformative development for Apple’s data center operations. Sources claim that TSMC’s first SoW offering is already in production. It is based on Integrated Fan-Out (InFO) technology. TSMC is also taking steps toward manufacturing 2nm and 1.4nm chips. These chipsets are likely preordained for future generations of Apple silicon.
Reports claim that Apple’s 2nm “N2” node is designed for trial production in the second half of 2024 and mass production in late 2025. It will be followed by an improved “N2P” process in late 2026. Trial production of the 2nm node will start in the second half of 2024. However, small-scale production will ramp up in the second quarter of 2025. It is pertinent to mention that facilities in Taiwan will start to shift toward the production of “A14” 1.4nm chips in 2027.
Apple’s upcoming A18 chips for the iPhone 16 series are anticipated to be based on N3E. On the other hand, the “A19” is tipped for the 2025 iPhone models. It is expected to be Apple’s first 2nm chip. Each consecutive TSMC node outperforms its predecessor in terms of transistor density, performance, and efficiency. So, let’s wait and watch what the upcoming chips bring to the highly anticipated iPhone 16 series.
